Semiconductor module



FIG. 1 is a front view of a semiconductor module, showing our new design;

FIG. 2 is a rear view of the semiconductor module of FIG. 1 ;

FIG. 3 is a left side view of the semiconductor module of FIG. 1 ;

FIG. 4 is a right side view of the semiconductor module of FIG. 1 ;

FIG. 5 is a top view of the semiconductor module of FIG. 1 ;

FIG. 6 is a bottom view of the semiconductor module of FIG. 1 ;

FIG. 7 is a front, top, left side perspective view of the semiconductor module of FIG. 1 ;

FIG. 8 is another front, top, left side perspective view of the semiconductor module of FIG. 1 ;

FIG. 9 is a front, bottom and right side perspective view of the semiconductor module of FIG. 1 ;

FIG. 10 is a rear, top, and left side perspective view of the semiconductor module of FIG. 1 ;

FIG. 11 is a rear, bottom, and right side perspective view of the semiconductor module of FIG. 1 ;

FIG. 12 is another rear, bottom, and right side perspective view of the semiconductor module of FIG. 1 ; and,

FIG. 13 is a cross sectional view taken along line 13-13 of FIG. 5 , in which the internal structure is omitted.

The broken lines shown in the drawings represent portions of the semiconductor module that form no part of the claimed design. 

CLAIM The ornamental design for a semiconductor module, as shown and described. 